ICAMMCE 2020 - The 2020 5th International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE2020)

[基本信息]

会议名称:ICAMMCE 2020 - The 2020 5th International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE2020)

开始日期:2020-03-02

结束日期:2020-03-04

所在国家:China

所在城市:Suzhou

[重要日期]

摘要截稿日期:2020-03-01

[会务组联系方式]

会议网站:http://www.icammce.com/

[征文范围及要求]

Website URL: http://www.icammce.com/ Start Date / End Date: March 20-22, 2020 Location: Suzhou, China Submission Deadline: February 5, 2020 1. About the conference: The 2020 5th International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE2020) will be held on March 20-22, 2020 in Suzhou, China. ICAMMCE2020 is Organized by AEIC Academic Exchange Information Centre. ICAMMCE 2020 is to bring together innovative academics and industrial experts in the field of materials, mechatronics and civil engineering to a common forum. The primary goal of the conference is to promote research and developmental activities in materials, mechatronics and civil engineering and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in materials, mechatronics and civil engineering and related. 2. Publication All accepted full papers will be published in IOP Conference Series: Materials Science and Engineering (MSE)(ISSN:1757-8981) and it will be submitted to EI Compendex, Scopus for indexing. 2)SCI Journal(Papers must not be less than 10 pages in length and should be submitted to servicekeoaeic.org, and noted SCI-ICAMMCE2020.) (1) Advances in Civil Engineering(ISSN: 1687-8086, IF=1.104) (2) KSCE Journal of Civil Engineering(ISSN:1976-3808, IF=1.428) (3) Journal of Materials Science: Materials in Electronics(ISSN: 2005-4602, IF=1.779) * SCI Secretary: Ms. Huang-Tel/WeChat 13922157854 * SCI Template: Template-SCI-EN.doc 3. Important Dates Submission Deadline:February 5, 2020 Notification Date:About 1-2 week after the submission Conference Date:March 20-22, 2020 4. Submission Guides 2020 5th International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE2020). Download: Manuscript Template | 文章模板 Please submit your papers as the following instructions: 1. Please send the full paper & abstract to SUBMISSION SYSTEM 2. Manuscript length should be within 4 pages (authors will be charged extra 50 USD/page if the manuscript length is more than 4 pages) 5. Call For Papers 2020 5th International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE 2020) aims to provide a high-level international forum for researchers, engineers and scientists to present the new advances and research results in the fields of Materials, Mechatronics and Civil Engineering. The topics of interest for submission include, but are not limited to: 1. Materials Science and Materials Processing Engineering (1)Materials of Lighting Source (2)Semi-conductor Materials (3)Insulating Materials (4)Electronic Materials (5)Non-ferrous Metal Material (6)Iron and Steel (7)Composites (8)Micro / Nano Materials (9)Ceramic (11)Optical/Electronic/Magnetic Materials (12)New Functional Materials (13)Building Materials and Environmentally Friendly Materials New Energy Materials (14)Environmental Friendly Materials (15)Earthquake Materials and Design (16)Biomaterials (17)Smart/Intelligent Materials/Intelligent Systems (18)Polymeric Materials (19)Thin Films (20)Corrosion of Materials and Surface Treatment Technology (21)Mechanical Behavior & Fracture (21)Tooling Testing and Evaluation of Materials (22)Research and Development of Composite Materials (23)Research and Development of New materials (24)New materials, New Technology and New Products 2. Electronics Engineering (1)3D Semiconductor Device Technology (2)Adaptive Signal Processing (3)Advanced Electromagnetics (4)Artificial Intelligence (5)Component Technology of MEMS (6)Compound Semiconductor Physics and Devices (7)Computer Engineering (8)Device Electronics for I.C (9)Electronics System-Level Based Design (10)Electronics & Nano Electronics (11)Electronics-Medical Electronics (12)Epitaxy and Light-emitting Diodes (13)Fiber Optics and Fiber Devices (14)Giznt Area Microelectronics (15)Intelligent Transportation Systems (16)Integrated Optics (17)Medicine and Biology Applications (18)Micro/Nano Systems and Networks (19)Mixed Signal Circuits (20)Mobile Computing (21)Mobile Robotics (22)Multimedia Services and Technologies (23)Networks Design, Protocols and Management (24)Optical Electronic Devices & Photonics (25)Radio-Frequency Integrated Circuits (26)Signal & Image Processing (27)VLSI Testing and Design for Testability 3. Architecture Design (1)Architectural Design and its Theory (2)Mapping and GIS (3)Measurement Engineering (4)Computing Mechanics (5)Construction Technology (6)Computer Simulation and CAD / CAE (7)Building Technology Science (8)Urban Planning and Design (9)Landscape Design (10)Building Environment and Equipment Engineering (11)Eco-buildings (12)Project Management (13)Quality Engineering Supervision and Control (14)Engineering Management 4. Civil Engineering and Construction Technology (1)Structural Engineering (2)Structural Monitoring and Control (3)Structural Repair, Transformation and Reinforcement (4)Structural Reliability and Durability (5)Geotechnics (6)Geological Engineering (7)Tunnel, Subway and Underground Facilities (8)Earthquake Engineering (9)Water Supply and Drainage (10)Coastal Engineering (11)Heating, Gas Supply, Ventilation and Air Conditioning Works (12)Disaster Prevention and Mitigation 5. Mechanical and Electrical Engineering and Construction Machinery (1)Mechanical Manufacturing Process and Equipment (2)Mechanical Manufacturing Automation (3)Mechanical History (4)Mechanical Dcience (5)Mechanical Design (6)Tool Technology (7)Machine tool Technology (8)Fluid Drive and Control (9)Electronic Science and Engineering (10)Industrial Electronics and Automation (11)Telecommunications Services and Applications 6. Other Related Topics 6. Registration ItemsRegistration fee (By US Dollar) Regular Registration (4 pages)450 USD/per paper Additional Paper (Students)430 USD/ per paper Extra Pages (Begin at Page 5)50 USD/ per extra page Attendees without Papers180 USD / per person Purchase Extra Journal(加购论文集)---75 USD/book 7. Schedule DateTimeActivity March 20, 202013:00-17:00Registration March 21, 202009:00-12:00Keynote Speech 12:00-14:00Lunch Time 14:00-17:30Oral Speech 18:00-19:30Banquet March 22, 202009:00-18:00Academic Investigation 8. Contact Us Conference Secretary: Yandrin Chan E-mail: ICAMMCE163.com Tel: +86-13422186485 WeChat: 13422186485 Yandrin Chan WeChat qr code: